ADDRESS
- Address: 서울특별시 금천구 가산디지털2로 184 510 (가산동, 벽산경인디지털밸리 2차)
- Email: inwon000@gmail.com
- Tel: +82-10-9599-3149
- Fax: +82-2-857-6835
최근, 지구 온난화 및 산업 패러다임이 변화함에 따라 에너지 절감을 위한 초경량, 고기능성의 고강도 복합재 부품에 대한 사용 요구가 급격히 증가하고 있다. 이에 따라 개발된 소재가 고분자 복합재료로 강화재(유리섬유, 탄소섬유 등)와 기지재(에폭시 등)가 가지는 우수한 기능을 조합하여 그 특성을 극대화 할 수 있다. 특히 CFRP(탄소섬유강화플라스틱)는 철 보다 10배 강한 강도 및 1/5 수준의 밀도를 가져 가벼우며 내피로성, 내열성, 내부식성, 내화학성 등이 우수하여 최근 금속을 대체하는 경량화 물질로 각광 받고 있다.
이러한 복합재료 기지재는 열경화성 수지로 에폭시가 대표적으로 사용되며, 이를 CFRP에 적용하기 위해서는 먼저 공법별(용도별)로 특별한 특성이 갖춰야 생산 및 제조가 가능하다.
| Grade | EEW (g/eq) | Refractive Index | Color (G) | Viscosity (cps at 25℃) | Features | Application |
|---|---|---|---|---|---|---|
| SE-250 | 220-270 | 1.60-1.70 | 3.0 Max | Solid | High Tg | Display, Semiconductor&Adhesive, Composite |
| SE-660 | 280-330 | 1.629-1.631 | 5.0 Max | Solid | Sulfuric Epoxy | Display, Semiconductor&Adhesive, Composite |
| SE-700 | 310-380 | 1.58-1.67 | 1.0 Max | Solid | High Tg | Display, Semiconductor&Adhesive, Composite |
| SE-750 | 180-240 | 1.61-1.71 | 5.0 Max | 500 Max | Sulfuric Epoxy | Display, Semiconductor&Adhesive, Composite |
| SE-770 | 330-380 | 1.64-1.74 | 5.0 Max | 8,000-13,000 | Sulfuric Epoxy | Display, Semiconductor&Adhesive, Composite |
| Grade | EEW (g/eq) | Refractive Index | Color (G) | Viscosity (cps at 25℃) | Features | Application |
|---|---|---|---|---|---|---|
| SE-80 | 135-160 | 0.3 Max.* | Red Brown | 200,000 Max | 1.6-Naphthalene Epoxy | Semiconductor&Adhesive, PCB, Composite, Paint&Coating |
| SE-90 | 135-160 | 0.3 Max.* | Yellow | Crystal | 2.7-Naphthalene Epoxy | Semiconductor&Adhesive, PCB, Composite, Paint&Coating |
| Grade | EEW (g/eq) | Color (G) | Viscosity (cps at 25℃) | Features | Application |
|---|---|---|---|---|---|
| SE-5000 | 240-280 | 5.0 Max | Solid | Biphenyl Novolac Epoxy | PCB, Composite, Semiconductor&Adhesive |
| SE-5555 | 310-370 | 5.0 Max | Solid | Biphenyl Novolac Epoxy | PCB, Composite, Semiconductor&Adhesive |
| Grade | EEW (g/eq) | Color (G) | Viscosity (cps at 25℃) | Application | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SEZ-250 | 180-220 | 1.0 Max* | 15,000-30,000** | Semiconductor&Adhesive, Composite, Paint&Coating | |||||||||||||||
| SE-5015 | 195-215 | 1.0 Max* | 1,500-3,500 | Semiconductor&Adhesive, Composite, Paint&Coating | |||||||||||||||
* Color (APHA) ** Viscosity (cps at 50℃) | |||||||||||||||||||
| Grade | EEW (g/eq) | Color (APHA) | Viscosity (cps at 25℃) | Features | Application | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SE-400H | 170-195 | - | Crystal | Biphenyl Epoxy | Semiconductor&Adhesive, PCB, Composite | ||||||||||||||
| SE-450H | 170-200 | - | Crystal | Biphenyl Epoxy | Semiconductor&Adhesive, PCB, Composite | ||||||||||||||
| SE-650 | 165-185 | 4 Max* | Crystal | Sulfuric Epoxy | Semiconductor&Adhesive, PCB, Composite | ||||||||||||||
* Color (Gardner) | |||||||||||||||||||
| Grade | EEW (g/eq) | T-Cl (ppm) | Color (G) | Viscosity (cps at 25℃) | Features | Application | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SE-187 | 180-200 | 0.4 Max | 8,000-12,000 | High Purity | Semiconductor&Adhesive, PCB, Composite, Paint&Coating | ||||||||||||||
| SE-187ME | 180-190 | 0.5 Max | 11,000-14,000 | High Purity, Non-Crylstalline | Semiconductor&Adhesive, PCB, Composite, Paint&Coating | ||||||||||||||
| SE-187M | 170-180 | 0.3 Max | 3,000-8,000 | High Purity | Semiconductor&Adhesive, PCB, Composite, Paint&Coating | ||||||||||||||
| SE-187PM | 170-175 | 0.3 Max | 3,000-6,000 | High Purity, Crylstalline | Semiconductor&Adhesive, PCB, Composite, Paint&Coating | ||||||||||||||
| SE-337M80 | 450-550 | 0.5 Max | 10,000-30,000 | N.V 80wt%, Solvent : MEK | PCB, Semiconductor&Adhesive, Paint&Coating | ||||||||||||||
| SE-80P | 135-150 | 0.4 Max | 15,000-30,000 | Naphthalene Epoxy, High Purity | Semiconductor&Adhesive, PCB, Composite, Paint&Coating | ||||||||||||||
| SE-300P | 90-110 | 5.0 Max | 1,000 Max | High Purity, High Tg | Composite, Semiconductor&Adhesive, PCB, Paint&Coating | ||||||||||||||
| SE-310P | 90-110 | 5.0 Max | 1,000-3,500 | High Purity, High Tg | Composite, Semiconductor&Adhesive, PCB, Paint&Coating | ||||||||||||||
| SE-320P | 100-115 | 5.0 Max | 2,000-4,000** | High Purity, High Tg | Composite, Semiconductor&Adhesive, PCB, Paint&Coating | ||||||||||||||
| SEF-170P | 155-160 | 0.5 Max | 1,000-3,000 | High Purity, BPF Epoxy, Hy-Cl 100ppm Max. | Semiconductor&Adhesive, Composite, PCB, Paint&Coating | ||||||||||||||
| SEF-1700P | 160-170 | 0.5 Max | 15 Max*** | High Purity, BPF Epoxy | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
| SEZ-250P | 190-200 | 1.0 Max | 10,000 Max** | High Purity, LED | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
| SE-650P | 160-180 | 30 Max(APHA) | 15 Max*** | High Purity, Sulfuric Epoxy | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
| SE-400HP | 160-185 | - | 15 Max*** | High Purity, Biphenyl Epoxy | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
| SE-5015P | 190-215 | 15 Max(APHA) | 2,500 Max | High Purity | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
| SEF-0187 | 160-170 | 0.5 Max | 2,000-4,000 | High Purity, BPF/BPA Type | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
| SE-4125P | 220-260 | 50 Max(APHA) | 1,000-2,500 | High Purity | Semiconductor&Adhesive, Composite, PCB | ||||||||||||||
* Hy-Cl content ** Viscosity (cps at 50℃) *** Viscosity (cps at 150℃) | |||||||||||||||||||
| Grade | EEW (g/eq) | Hy-Cl (ppm) | Color (G) | Viscosity (cps at 25℃) | Application |
|---|---|---|---|---|---|
| SER-200 | 180-230 | - | 5.0 Max | 8,000-18,000 | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-250 | 230-280 | - | - | - | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-450 | 400-500 | 500 Max | 7.0 Max | 4,000 Max | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-650 | 400-500 | 500 Max | 7.0 Max | Semi-Solid | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-550 | 350-450 | 500 Max | 7.0 Max | 30,000 Max | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-830 | 190-220 | 500 Max | Milky Brown | Semi-Solid | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-1100 | 200-220 | 500 Max | Milky White | Semi-Solid | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-1500 | 1,700-2,200 | 500 Max | 7.0 Max | Solid | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| SER-1300 | 250-280 | - | Milky White | Semi-Solid | Semiconductor&Adhesive, Composite, PCB, Paint&Coating |
| Grade | EEW (g/eq) | N.V (wt%) | Color (G) | Viscosity (cps at 25℃) | Solvent | Features | Application |
|---|---|---|---|---|---|---|---|
| SCT-150 | 150-200 | 100 | - | - | Solid | BPF Novolac Epoxy | Semiconductor&Adhesive, PCB, Composite |
| SPE-166 | 160-180 | 100 | - | 7,000-10,000 | Solid | Phenol Novolac Epoxy | PCB, Semiconductor&Adhesive, Composite, Paint&Coating |
| Grade | EEW (g/eq) | N.V (wt%) | P Content (wt%) | Viscosity (cps at 25℃) | Features | Application |
|---|---|---|---|---|---|---|
| XEN-0140 | 400-460 | 55-65* | 4.0 | 500 Max | BPA Epoxy + DOPO | PCB, Paint&Coating |
| XEN-0230 | 280-340 | 65-75* | 3.0 | 500 Max | Novolac + DOPO | PCB, Paint&Coating |
| Grade | OH EW (g/eq) | Softening Point (℃) | Free Monomer (wt%) | Appearance | Features | Application |
|---|---|---|---|---|---|---|
| SCT-120 | 90-110 | 125-135 | TPM Novolac | Reddish Brown | TPM Novolac | PCB, Semiconductor&Adhesive, Composite |
| SHE-5000 | 173-179 | 105-115 | O-Phenyl Phenol Novolac | Reddish Brown | O-Phenyl Phenol Novolac | PCB, Semiconductor&Adhesive, Composite |
| SHV-2990 | 173-180 | 85-95 | Xylok | Reddish Brown | Xylok | PCB, Semiconductor&Adhesive, Composite |
| Grade | OH EW (g/eq) | N.V. (wt%) | P Content (wt%) | Viscosity (cps at 25℃) | Features | Application |
|---|---|---|---|---|---|---|
| LC-750 | 125-165 | 54-56 | 4.8 - 5.0 | 1,000 Max. | UV Blocking Hardener with Phosphorus | PCB, Semiconductor&Adhesive, Composite, Paint&Coating |
| LC-760 | 130-180 | 54-56 | 4.8 - 5.0 | 1,000 - 3,000 | UV Blocking Hardener with Phosphorus | PCB, Semiconductor&Adhesive, Composite, Paint&Coating |
| LC-770 | 280-320 | 54-56 | 9.05 - 9.4 | 1,000 Max. | UV Blocking Hardener with Phosphorus | PCB, Semiconductor&Adhesive, Composite, Paint&Coating |
| Grade | Amine Value (㎎ KOH/g) | Melting Point (℃) | Features | Application |
|---|---|---|---|---|
| LC-10 | - | 150 - 160 | White Powder | Coating, Adhesives, PCB, Semiconductor&Adhesive, Composite |
| LC-30 | 110 - 130 | 100 - 120 | White Powder | Coating, Adhesives, PCB, Semiconductor&Adhesive, Composite |
| LC-30C | 100 - 130 | 120 - 130 | White Powder | Coating, Adhesives, PCB, Semiconductor&Adhesive, Composite |
| SNH-1201 | 110 - 135 | 100 - 120 | Brown Solid | Coating, Adhesives, PCB, Semiconductor&Adhesive, Composite |
| Grade | Amine Value (㎎ KOH/g) | N.V. (wt%) | Viscosity (cps at 25℃) | Features | Application |
|---|---|---|---|---|---|
| LC-500 | 90 - 130 | 53-56 | 100 - 400 | Brown Liquid | PCB, Semiconductor&Adhesive, Composite |
| LC-600 | 90 - 120 | 52-56 | 100 - 400 | Brown Liquid | PCB, Semiconductor&Adhesive, Composite |
| LC-800 | 170 - 210 | 97.0 Min. | 20,000 - 50,000 | Brown Liquid | PCB, Semiconductor&Adhesive, Composite |
| SHT-1003 | 100 - 140 | - | 2,000 - 5,000 | Brown Liquid | PCB, Semiconductor&Adhesive, Composite |
| SHT-1004 | 240 - 280 | - | 3,000 - 6,000 | Brown Liquid | PCB, Semiconductor&Adhesive, Composite |
| Grade | Features | Mixing Ratio (wt%) | Mixing Viscosity (cps at 25℃) | Pot Life (100g at 25℃) | Typical Cured Tg (℃) |
|---|---|---|---|---|---|
| SCL-F570R/SCL-F570H | Halogen Free Flame Retardent (UL V-0) | 100 / 12 | 7,000 - 8,000 | 30 min | 80 - 90 |
| SCL-S330R/SCL-S530H | Fast Type | 100 / 35 | 800 - 1,000 | 15 - 25 min | 70 - 80 |
| SCL-S300R/SCL-S300H | Standard Type | 100 / 14 | 400 - 600 | 55 - 65 min | 70 - 80 |
| SCL-S330R/SCL-S130H | Slow Type | 100 / 25 | 500 - 700 | 190 - 200 min | 70 - 80 |
| Grade | Features | Mixing Ratio (wt%) | Mixing Viscosity (cps at 25℃) | Typical Cured Tg (℃) | Suggested Processing |
|---|---|---|---|---|---|
| SCH-J300R/SCH-J300H | Fast Curing Low cost | 100 / 20 | 300 - 600 | 80 - 95 | Applied for HP-RTM Machine of Krauss Maffei. |
| SCH-H310R/SCH-H310H | Fast Curing Middle Tg | 100 / 25 | 400 - 700 | 90 - 105 | Applied for HP-RTM Machine of Krauss Maffei. |
| SCH-I310R/SCH-I310H | Fast Curing Low Total-Cl | 100 / 20 | 400 - 700 | 80 - 100 | Applied for HP-RTM Machine of Krauss Maffei. |
| SCH-H312R/SCH-H312H | Fast Curing Low Total-Cl High Tg | 100 / 19 | 400 - 700 | 100 - 120 | Applied for HP-RTM Machine of Krauss Maffei. |
| SCH-F380R/SCH-J300H | Fast Curing Low Total-Cl Halogen Free Flame Retardent (UL V-0) | 100 / 12 | 700 - 1,000 | 65 - 75 | Applied for HP-RTM Machine of Krauss Maffei. |
| SCH-J320R/SCH-J320H | Fast Curing High Tg Low cost | 100 / 19 | 1,000 - 2,500 | 110-130 | Applied for HP-RTM Machine of Krauss Maffei. |
| Grade | Features | Mixing Ratio (wt%) | Mixing Viscosity (cps at 25℃) | Pot Life (100g at 25℃) | Typical Cured Tg (℃) |
|---|---|---|---|---|---|
| SCF-S318R/SCF-S318H | Standard Temperature Curing | 100 / 100 | 200 - 400 | 1 day | 150-160 |
| SCF-S110R/SCF-S110H | Low Temperature Curing | 100 / 35 | 1,000 - 1,500 | 2~3 hr | 85-95 |
| SCF-H530R/SCF-H530H | High Temperature Curing / High Tg | 100 / 49 | 500 - 1,000 | 1 day | 205-215 |
| SCF-H540R/SCF-H540H | High Temperature Curing / Moisture Resistance | 100 / 95 | 300 - 700 | 1 day | 180-190 |
| SCF-H550R/SCF-H550H | High Temperature Curing / Moisture Resistance | 100 / 111 | 200 - 500 | 1 day | 190-200 |
| Grade | Features | Viscosity (70℃, cps) | Typical Curing Cycle | Typical Cured Tg (℃) | Suggested Processing |
|---|---|---|---|---|---|
| SCP-R120 | Standard/Versatile High Resin Flow | 13,000 - 15,000 | For Mandrel Rolling 30min@80℃ + 90min@125℃ | 120 | Mandel Rolling |
| SCP-R230 | Standard/Versatile Medium Resin Flow | 19,000 - 21,000 | For Mandrel Rolling 30min@80℃ + 90min@125℃ | 120 | Mandel Rolling |
| SCP-S100 | Standard/Versatile High Resin Flow | 24,000 - 26,000 | For Mold Process 30min@150℃ For Mandrel Rolling 30min@80℃ + 90min@125℃ | 125 | Mandel Rolling Mold (High flow application) - Press Molding - Vacuum Bag Molding |
| SCP-S300 | Standard/Versatile Medium Resin Flow | 34,000 - 36,000 | For Mandrel Rolling 30min@80℃ + 90min@125℃ | 125 | Mold (Medium flow application) - Bladder Molding (inflation) - Autoclave Molding - Press Molding Mandrel Rolling |
| SCP-S500 | Standard/Versatile Low Resin Flow | 47,000 - 53,000 | For Mandrel Rolling 30min@80℃ + 90min@125℃ | 120 | Mold (Low flow application) - Bladder Molding (inflation) - Autoclave Molding - Press Molding |
| SCP-T325 | High Performance (Highly Toughened) | 6,500 - 7,500 | For Mandrel Rolling 30min@80℃ + 90min@125℃ | 135 | Mold - All kinds of mold processing Mandrel Rolling |
| SCP-H165 | High Tg | 36,000 - 38,000 | Without post-cure 60min@175℃ With post-cure 30min@150℃ + 2hrs@175℃ (PC) | >165 | Mold - All kinds of mold processing |
| SCP-L510 | Fast Cure | 20,000 - 22,000 | 10min@150℃ | 125 | Mold - All kinds of mold processing |
| SCP-C500 | Good Surface Quality Controlled Resin Flow | 53,000 - 57,000 | 30min@80℃ + 90min@125℃ | 130 | - |
| Grade | Features | Mixing Ratio (wt%) | Mixing Viscosity (cps at 25℃) | Pot Life (100g at 25℃) | Typical Cured Tg (℃) |
|---|---|---|---|---|---|
| SCI-S300R/SCI-S520H | Fast type | 100 / 25 | 200 - 400 | 220 min | 115-125 |
| SCI-S320R/SCI-S320H | Standard type | 100 / 25 | 200 - 400 | 240 min | 90-100 |
| SCI-S300R/SCI-S300H | Standard type | 100 / 27 | 200 - 400 | 300 min | 105-115 |
| SCI-S300R/SCI-S150H | Slow type | 100 / 32 | 200 - 400 | 500 min | 85-95 |
| SCI-S300R/SCI-S140H | Slow type | 100 / 28 | 200 - 400 | 400 min | 95-105 |